The new substrate is expected to become a new breakthrough in the chip industry, and many listed companies responded to their layout. Oriental Crystalline Silicon New Materials also has a corresponding broad prospect.

Chip substrate and printed circuit board applications

Morgan Stanley revealed that the advanced packaging process used in the powerful AI superchip produced by Nvidia may use glass substrates, mainly because compared with silicon and organic substrates, glass substrates have the advantages of adjustable strength, low energy consumption and high temperature resistance.

This application direction is also what Oriental Crystalline Silicon New Materials has been actively exploring.
In addition to NVIDIA, major manufacturers such as Intel, Samsung, AMD, and Apple will also plan to introduce or explore new substrate chip packaging technologies.